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Manufacturing process of aluminum oxide (al oxide) PCBs  and LED modules is simple enough and requires a limited number of technological operations.

The core of the al oxide PCB manufacturing process is aluminum oxidation and deposition followed by the copper layer plating. These processes represent the main difference from the standard MCPCB manufacturing operations and determine the benefits of al oxide PCB both in the field of thermal management and in solving design problems. The unique feature of al oxide technology is that the manufacturing process uses the well-known technological operations to create a completely new product.


Blue rectangle – common manufactiring steps with MCPCB

Red rectangle – specific manufactiring steps for al oxide PCB