Considering characteristics of multi-functional electronics products, various electronic components shalle be mounted on a single substrate. Recently, a heat dissipating problem caused by heat generating elements mounted on the substrate has been an issue. The unique heat-radiating substrate including an insulating layer formed on a metal core layer and a circuit layer formed on the insulating layer have been commercialized and patented up to now by RUSALOX LLC. The heat-radiating substrate has excellent heat-radiating property as compared to a general organic PCB; moreover, it is possible to implement high density/integration of the heat-radiating substrate.
In addition, when heat generating elements such as LED and electronic components vulnerable to heat are simultaneously mounted on a single substrate, the al oxide heat-radiating substrate has high itegral thermal conductivity (120 W/mK), such that heat generated from the heat generating elements is transferred to the entire heat-radiating substrate (in particular, through a metal core layer) and is also transferred to an area where heat is not transferred, thereby degrading the performance of the thermally weakened elements.
Electrochemical aluminum oxide technology is the technology based on a combination of the process of anodic oxidation (anodization) of aluminum with well-mastered microelectronic base operations (vacuum metal deposition and photolithography) for use in electrical engineering, electronics and semiconductor industries.
The necessity of fast and efficient heat dissipation is one of the major problems of semiconductor and power electronics devices. One way to solve the problem is to use circuit boards with the selective stepwise oxidation of aluminum. Substrates manufactured with thу patented al oxide technology are made of two main parts: aluminum base and dielectric layer with nanopourous structure. Thу metal-based high thermal conductivity material creates the considerable competitive advantage of these substrates over those made with traditional technology.
One of the main application areas of al oxide now is high power LED lighting (explosion-proof lights, high bays, spotlights, projectors, horticultural lighting, UV lighting, etc), where the heat-dissipating problem is the most critical. The al oxide technology allows decreasing the temperature of the crystal by means of fast heat dissipation. This technological approach allowed creating a new type of inexpensive commutating plates with high thermal conductivity.
In addition to the LED industry, the problem of heat removal is very important in modern power electronics devices, such as IGBT, IPM, DIPIPM modules and microwave bridges. The majority of such power modules manufacturers often use the sintered alumina ceramics (Al2O3) and expensive alumina nitride ceramics (AlN) as substrates for their high voltage and high power devices. The standard structure of IGBT module involves the use of a baseplate, made of copper or aluminum, which is attached to the ceramic substrate through TIM. This design significantly increases the cost of a power module, and the presence of clued (joined) between themselves components affects reliability and service life of a device.
Substrate for power modules, in particular IGBT modules, manufactured following RUSALOX al oxide technology, allows not only to use a cost-effective product with high thermal conductivity, but not to eliminate a baseplate as the al oxide material itself is a composite material with a metal base, which successfully replaces both substrate and baseplate within modern power modules.
Manufacturing process of aluminum oxide (al oxide) PCBs and LED modules is simple enough and requires a limited number of technological operations.
The core of the al oxide PCB manufacturing process is aluminum oxidation and deposition followed by the copper layer plating. These processes represent the main difference from the standard MCPCB manufacturing operations and determine the benefits of al oxide PCB both in the field of thermal management and in solving design problems. The unique feature of al oxide technology is that the manufacturing process uses the well-known technological operations to create a completely new product.
RUSALOX al oxide technology meets the requirements of EU Directive – RoHs – and UL recognized for both laminate and PCB. This technology is a broad process platform and is used in different electronics products, such as Chip-On-Board (COB), automotive lighting, UV lighting, microwave electronics, SiP systems (System in Package), SOC systems (System on Chip), high-capacity modules, IGBT modules, Peltier elements, etc.