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PCB, based on al oxide technology, consists of conductive layers of aluminum and/or copper and dielectric material with nanoporous structure. The products manufactured by al oxide technology have successfully passed all the necessary tests (including tests of thermal reliability), and today we can safely say that al oxide products superior substitute products on the main consumer characteristics (the thermal conductivity is hundreds of times higher, the price is 20%-30% lower, the reliability is twice more). It is crucial that this technology is environmentally friendly, namely final products can then be easily disposed that distinguishes it from traditional MCPCB.

Design rules for al oxide PCB

Parameters Recommended value Limit value1
 1. PCB thickness, mm

1,5; 1,0; 0,381

2. Oxide thickness, µm (2 µm cover all the plate’s surface) 702 80±102
3. Copper thickness, µm 352 5-802
4. Finish layer  immersion silver, immersion gold ENIG
5. Finish layer thickness solderability ensuring
6. The maximum size of the working area of the PCB, mm 290х450 , 460×5604
7. Processing of contour scribing, milling
8. Color marking oxide (extrication in mask) white, black, green, tin
9. Color of solder mask white (RS2000 or analogue), black, green
10. Number of layers Top and bottom
11. Minimum width of the conductor, mm 0,3+0,053
12. Minimum guaranteed band of vias, mm 0,35 0,25+teardrop
13. Minimum gap between conductive elements, mm 0,5 0,3
14. Minimum gap between the circuit board and current elements, mm 1 0,6


Width of the mask exemption by the line of
– Scribing 0,8
– Milling milling cutter diameter + 0,25
– Drilling drill diameter + 0,2
16. Minimum diameter of the via, mm (recommend no more than 10 vias on the PCB)                     1,5

(+)200 µm,

(-) no requirements


(+)200 µm,

(-) no requirements

17. Minimum diameter of the holes, mm 0,6±0,2
18. Minimum diameter of metallized vias for components’ mounting, mm 1,5±0,2 0,8±0,2
19. Countersink in the vias for wires, mm 0,5х45º
20. Minimum  gap between the pad and the solder mask, mm 0,2 0,1
21. Minimum size of the separate area of solder mask, mm (e.g. between pads) 0,3 0,15
22. Marking resolution exposure/ silkscreen, mm 0,3/0,4 0,25/0,3
23. Minimum height of the font marking (silkscreen), mm 1,5 1,2
24 Minimum height of the font marking (exposure), mm 1
25. Minimum size of oxide extrication while marking on the finish surface, mm 0,4 0,3
26. Minimum gap between the marking and the pad release (exposure / silkscreen), mm 0,2/1
 27. Distance between the board edge and marking, mm 0,5

If the construction of the module does not comprehend using insulating sleeves or washers, it is necessary to perform oxide release in the mounting holes:

– in OxidTop, mm Ø screw head (Ø of flange rivets) +0,3
– in OxidBot, mm Ø via + 0,3
– in MaskTop, mm Øscrew head (Ø of flange rivets), line thickness 0,3 mm
29. Minimum gap between the board edges and oxide elements, mm 0,4 0,3
30. Minimum size of a separate oxide section, mm 2,5 1
31. Minimum gap  between oxide elements, mm 2 1
 32. Guaranteed  size of copper conductors coverage by  oxide layer, mm 0,3 0,25
33. Rounding radius of oxide corner elements, mm 0,8 0,5
34. Fiducial marks. Diameter  Top/PasteTop/MaskTop, mm 1/1/2,5 1/1/2

1 from 2Q 2017 wider production values are to be introduced, e.g laser drilling, high precision, smaller via diameters, etc.

2 standard value for the LED industry, can be changed depending on application

3 sampling can be made with high precision upon the request

4 after production expansion in 2018