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AL OXIDE PCB Gen. 3.0

AL OXIDE PCB Gen. 3.0  is specifically developed product for applications where beyong high thermal conductivity (100 W/mK) 3L structure is required. By controlled two-stage anodizing process and further  modified production processes enable RUSALOX to produce product with following capacities (see the pic above for more understanding):

  1. Mounting SMD components on an insulated conductor (Al2O3).
  2. Mounting SMD components on a common layer (Aluminum base).
  3. Assembling PTH components into isolated hole.
  4. Assembling PTH components on a common layer (Aluminum base).
  5. Creation of via-holes in layers through insulated holes.

Fullcycle production inhouse

RUSALOX specializes in producing high thermal conductive substrates of any complexity and offers its partners additional services:

  • design of al oxide PCB and all necessary production documentation handling
  • consulting and technical support by Engineering Depart.
  • testing of al oxide products in the presence of highly qualified employees of RUSALOX

Highly qualified specialist

All RUSALOX employees have solid experience in designing and producing PCBs, electronics, high technologies development and engineering. The majority of them have been involved in al oxide technology development and further serial production from company’s foundation. Our high-tech engineers are open-minded and eager to find a suitable solution for unique specific applications.

 

Quality and reliability

Quality is insured by high-precision electro-testing setups, visual and mechanical control, microscopy. All al oxide PCBs and substrates go through careful inspection of Technological Depart. And correspond to the strictest standard of  ISO 9001:2008, RoHS, UL.

 

Serial production of innovative nanotechnology  

RUSALOX is the only company in the world, which have successfully mastered al oxide technology and launched ass production of products based on it.