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For power and extra power Chip-On-Boards (COB) many LED packaging companies and LED manufacturers are using aluminum nitrite (AlN) and standard aluminum oxide (Al2O3) substrates, which provide thermal conductivity of 170 W/mK and 20-27 W/mK, respectively. RUSALOX, as a manufacturer of its patented aluminum oxide (al oxide) substrates and PCBs, offers an alternative for AlN material – al oxide PCB has ceramics performance in terms of thermal conductivity (min. 120W/mK) and mechanical features of all-beloved IMS materials.

Up to now, AlN laminates are mostly welcomed by major market players as the most reliable and efficient material for LED industry, however, RUSALOX al oxide material outscores AlN in a range of critical moments:

  • Competitive price
  • Not fragility
  • Possibility to produce PCBs of any shape and size
  • Big panel-up production of 490×330 mm, which allows further easy SMD and Wire Bonding
  • Scalable cost production
  • Resistance to electromagnetic interference
  • Possibility to produce double-sided PCBs with metallized vias (PTH)

RUSALOX is always looking for new challenges and striving to be up-to-date on the market, thus, highly qualified team of technologists and engineers are proceeding with R&D work in order to increase the reflectivity rate of al oxide PCB (up to 97 %) through mirror surface. There is also a huge project going on to produce al oxide material of different colours – from snow white to dark black.

Worth noting, al oxide material is non-organic, thus, aggressive influence of the atmosphere does not entail negative consequences such as degradation of the al oxide material. Moreover, RUSALOX is able to anodize any form while standard AlN/Al2O3 ceramics are planar materials.

Due to unique capabilities and technical properties of RUSALOX al oxide material, it is possible to use the al oxide substrate as GND. For COB industry, Rusalox makes the anode tire as an al oxide laminate with oxide extrication right under the mounting components (crystals in this case) as shown on the picture below, which, apropos, is impossible to implement on AlN/Al2O3 ceramics.


Possibility to perform oxide extrication under thermal pad of LED, chip or any mounting component